4114 BAUTEILEPDF hochladen

Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

Bauteile (4124 Bauteilen · Seite 3/258)

Zeige 33–48 von 4124 Bauteilen

DFN-8-EP(3x3) · 9P

MCP1727-3302E/MF (DFN-8-EP(3x3)) - 3D-Modell (DFN-8-EP(3x3))

MCP1727-3302E/MF

MICROCHIP·DFN-8-EP(3x3)

READY

9P3.0×3.0×0.90mmP=0.65mm2.3V to 6.0V

Standard-Elektronik- & Steckverbinderbauteil

QFN-44-EP(8x8) · 45P

ENC424J600T-I/ML (QFN-44-EP(8x8)) - 3D-Modell (QFN-44-EP(8x8))

ENC424J600T-I/ML

MICROCHIP·QFN-44-EP(8x8)

READY

45P8.0×8.0×0.90mmP=0.65mm3.0V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

VQFN-32-EP(5x5) · 33P

ATMEGA88A-MU (VQFN-32-EP(5x5)) - 3D-Modell (VQFN-32-EP(5x5))

ATMEGA88A-MU

MICROCHIP·VQFN-32-EP(5x5)

READY

33P5.0×5.0×1.00mmP=0.5mm

Eingebetteter Mikrocontroller (MCU)

SSOP-28-208mil · 28P

PIC32MX130F064B-I/SS (SSOP-28-208mil) - 3D-Modell (SSOP-28-208mil)

PIC32MX130F064B-I/SS

MICROCHIP·SSOP-28-208mil

READY

28P10.2×5.3×2.00mmP=0.65mm2.3V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

PDIP-28 · 28P

ATMEGA168PA-PU (PDIP-28) - 3D-Modell (PDIP-28)

ATMEGA168PA-PU

MICROCHIP·PDIP-28

READY

28P7.0×7.0×3.85mmP=2.54mm1.8V to 5.5V

Eingebetteter Mikrocontroller (MCU)

MSOP-8 · 8P

MCP4162-502E/MS (MSOP-8) - 3D-Modell (MSOP-8)

MCP4162-502E/MS

MICROCHIP·MSOP-8

READY

8P3.0×3.0×1.10mmP=0.65mm2.7V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

MSOP-8 · 8P

MCP4802-E/MS (MSOP-8) - 3D-Modell (MSOP-8)

MCP4802-E/MS

MICROCHIP·MSOP-8

READY

8P3.0×3.0×1.10mmP=0.65mm2.7V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-20-300mil · 20P

PIC16F1709-I/SO (SOIC-20-300mil) - 3D-Modell (SOIC-20-300mil)

PIC16F1709-I/SO

MICROCHIP·SOIC-20-300mil

READY

20P12.8×7.5×2.70mmP=1.27mm1.8V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-18-300mil · 18P

PIC16LF1847-I/SO (SOIC-18-300mil) - 3D-Modell (SOIC-18-300mil)

PIC16LF1847-I/SO

MICROCHIP·SOIC-18-300mil

READY

18P11.6×7.5×2.70mmP=1.27mm1.8V-5.5V

Standard-Elektronik- & Steckverbinderbauteil

TFBGA-121 · 121P

PIC32MX575F512L-80I/BG (TFBGA-121) - 3D-Modell (TFBGA-121)

PIC32MX575F512L-80I/BG

MICROCHIP·TFBGA-121

READY

121P10.0×10.0×1.10mmP=0.8mm2.3V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

TDFN-8-EP(3x3) · 9P

PIC12F1572-E/MF (TDFN-8-EP(3x3)) - 3D-Modell (TDFN-8-EP(3x3))

PIC12F1572-E/MF

MICROCHIP·TDFN-8-EP(3x3)

READY

9P3.0×3.0×0.85mmP=0.65mm1.8V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

QFN-28-EP(6x6) · 29P

PIC16F1827T-I/ML (QFN-28-EP(6x6)) - 3D-Modell (QFN-28-EP(6x6))

PIC16F1827T-I/ML

MICROCHIP·QFN-28-EP(6x6)

READY

29P6.0×6.0×1.00mmP=0.65mm1.8V-5.5V

Standard-Elektronik- & Steckverbinderbauteil

PLCC-28(11.5x11.5) · 28P

TC14433AELI (PLCC-28(11.5x11.5)) - 3D-Modell (PLCC-28(11.5x11.5))

TC14433AELI

MICROCHIP·PLCC-28(11.5x11.5)

READY

28P11.5×11.5×1.15mmP=1.27mm5V -5V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-16 · 16P

SY100S834LZC-TR (SOIC-16) - 3D-Modell (SOIC-16)

SY100S834LZC-TR

MICROCHIP·SOIC-16

READY

16P9.9×3.9×1.75mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

PDIP-8 · 8P

93LC66B-E/P (PDIP-8) - 3D-Modell (PDIP-8)

93LC66B-E/P

MICROCHIP·PDIP-8

READY

8P9.6×6.3×4.20mmP=2.54mm

Standard-Elektronik- & Steckverbinderbauteil

SOIC-28-300mil · 28P

PIC32MX150F128B-I/SO (SOIC-28-300mil) - 3D-Modell (SOIC-28-300mil)

PIC32MX150F128B-I/SO

MICROCHIP·SOIC-28-300mil

READY

28P17.9×7.5×2.70mmP=1.27mm2.3V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

Entdecken Bauteile Gehäuse Hersteller Upload