4026 BAUTEILEPDF hochladen

Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

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SMD-41P · 41P

ESP32-S2-SOLO-2U-N4R2 (SMD-41P) - 3D-Modell (SMD-41P)

ESP32-S2-SOLO-2U-N4R2

ESPRESSIF·SMD-41P

READY

41P19.2×18.0×3.20mmP=1.27mm3.0 ~ 3.6 V

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

SOP-16 · 16P

CH340G (SOP-16) - 3D-Modell (SOP-16)

CH340G

READY

16P9.9×3.9×1.75mmP=1.27mm3.3V to 5V

Schnittstellen-Bridge & Takt-/Timer-IC

LQFP-48(7x7) · 48P

STM32F103C8T6 (LQFP-48(7x7)) - 3D-Modell (LQFP-48(7x7))

STM32F103C8T6

ST·LQFP-48(7x7)

READY

48P7.0×7.0×1.60mmP=0.5mm

Eingebetteter Mikrocontroller (MCU)

SOP-16 · 16P

CH340C (SOP-16) - 3D-Modell (SOP-16)

CH340C

READY

16P9.9×3.9×1.75mmP=1.27mm

Schnittstellen-Bridge & Takt-/Timer-IC

SOT-223 · 4P

AMS1117-3.3 (SOT-223) - 3D-Modell (SOT-223)

AMS1117-3.3

Advanced Monolithic Systems·SOT-223

READY

4P6.5×3.5×1.80mmP=2.29mm5V to 3.3V

Low-Dropout-Linearspannungsregler (LDO)

0805 · 2P

0805W8F1004T5E (0805) - 3D-Modell (0805)

0805W8F1004T5E

UNI-ROYAL·0805

READY

2P2.0×1.2×0.50mmP=1.9mm

Standard-Elektronik- & Steckverbinderbauteil

LQFN-56(7x7) · 57P

RP2040 (LQFN-56(7x7)) - 3D-Modell (LQFN-56(7x7))

RP2040

Raspberry Pi·LQFN-56(7x7)

READY

57P7.0×7.0×0.90mmP=0.4mm

Eingebetteter Mikrocontroller (MCU)

SMD-38P · 39P

ESP32-WROOM-32E(M113EH6400PH3Q0) (SMD-38P) - 3D-Modell (SMD-38P)

ESP32-WROOM-32E(M113EH6400PH3Q0)

ESPRESSIF·SMD-38P

READY

39P25.5×18.0×3.10mmP=1.27mm3.0 ~ 3.6 V

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

DIP-8 · 8P

NE555P (DIP-8) - 3D-Modell (DIP-8)

NE555P

READY

8P9.6×6.3×3.50mmP=2.54mm4.5 V to 16 V

Schnittstellen-Bridge & Takt-/Timer-IC

TQFP-32(7x7) · 32P

ATMEGA328P-AU (TQFP-32(7x7)) - 3D-Modell (TQFP-32(7x7))

ATMEGA328P-AU

MICROCHIP·TQFP-32(7x7)

READY

32P7.0×7.0×1.00mmP=0.8mm

Eingebetteter Mikrocontroller (MCU)

SOT-223-3 · 8P

MCP1790-3302E/DB (SOT-223-3) - 3D-Modell (SOT-223-3)

MCP1790-3302E/DB

MICROCHIP(美国微芯)·SOT-223-3

READY

8P

3.3V 70mA 30V

TDFN-8-EP(2x3) · 8P

MCP6072T-E/MNY (TDFN-8-EP(2x3)) - 3D-Modell (TDFN-8-EP(2x3))

MCP6072T-E/MNY

MICROCHIP(美国微芯)·TDFN-8-EP(2x3)

READY

8P

低功耗高精度运算放大器

SOT-23-3 · 8P

MCP809T-450I/TT (SOT-23-3) - 3D-Modell (SOT-23-3)

MCP809T-450I/TT

MICROCHIP(美国微芯)·SOT-23-3

READY

8P

MCP809T-450I/TT

TO-220 · 8P

IRFIZ48NPBF (TO-220) - 3D-Modell (TO-220)

IRFIZ48NPBF

MICROCHIP(美国微芯)·TO-220

READY

8P

1个N沟道耐压:55V 电流:40A

VSOP-40 · 8P

AT27C2048-15VC (VSOP-40) - 3D-Modell (VSOP-40)

AT27C2048-15VC

MICROCHIP(美国微芯)·VSOP-40

READY

8P

2M位OTP EPROM，高速读取，低功耗，CMOS和TTL兼容

TO-18 · 8P

2N2907A (TO-18) - 3D-Modell (TO-18)

2N2907A

MICROCHIP(美国微芯)·TO-18

READY

8P

2N2907A

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