4014 BAUTEILEPDF hochladen

Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

Bauteile (4024 Bauteilen · Seite 252/252)

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SOIC-8 · 8P

25LC080CT-E/SN (SOIC-8) - 3D-Modell (SOIC-8)

25LC080CT-E/SN

MICROCHIP(美国微芯)·SOIC-8

READY

8P

8Kbit SPI串行EEPROM

TSSOP-8 · 8P

25LC320AX-I/ST (TSSOP-8) - 3D-Modell (TSSOP-8)

25LC320AX-I/ST

MICROCHIP(美国微芯)·TSSOP-8

READY

8P

25LC320AX I/ST

TSSOP-8 · 8P

AT24CS01-XHM-B (TSSOP-8) - 3D-Modell (TSSOP-8)

AT24CS01-XHM-B

MICROCHIP(美国微芯)·TSSOP-8

READY

8P

I2C兼容串行EEPROM，带唯一128bit 序列号，1Kbit容量

UDFN-8-EP(2x3) · 8P

AT24C32D-MEHM-T (UDFN-8-EP(2x3)) - 3D-Modell (UDFN-8-EP(2x3))

AT24C32D-MEHM-T

MICROCHIP(美国微芯)·UDFN-8-EP(2x3)

READY

8P

32Kbit I²C兼容串行EEPROM

MLF-8 · 8P

MIC5330-JGYML-TR (MLF-8) - 3D-Modell (MLF-8)

MIC5330-JGYML-TR

MICROCHIP(美国微芯)·MLF-8

READY

8P

MIC5330-JGYML-TR

MLF-6 · 8P

MIC5320-SOYMT-TR (MLF-6) - 3D-Modell (MLF-6)

MIC5320-SOYMT-TR

MICROCHIP(美国微芯)·MLF-6

READY

8P

MIC5320-SOYMT-TR

Through Hole,Right Angle,P=2mm · 8P

HX PM2.0-1x3P WC H6.35 (Through Hole,Right Angle,P=2mm) - 3D-Modell (Through Hole,Right Angle,P=2mm)

HX PM2.0-1x3P WC H6.35

hanxia·Through Hole,Right Angle,P=2mm

READY

8P

Female Header 3 Position 2mm Pitch Single Row Through Hole, Right Angle -40℃~+105℃

- · 8P

CH32V003F4P6-EVT+WCH-LinkE (-) - 3D-Modell (-)

CH32V003F4P6-EVT+WCH-LinkE

WCH(南京沁恒)·-

READY

8P

评估板两件套,含CH32V003测试板一块,LINK-E一个两件套

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