3923 BAUTEILEPDF hochladen

Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

Bauteile (3944 Bauteilen · Seite 246/247)

Zeige 3921–3936 von 3944 Bauteilen

SMD-38P · 39P

ESP32-WROOM-32E(M113EH6400PH3Q0) (SMD-38P) - 3D-Modell (SMD-38P)

ESP32-WROOM-32E(M113EH6400PH3Q0)

ESPRESSIF·SMD-38P

READY

39P25.5×18.0×3.10mmP=1.27mm3.0 ~ 3.6 V

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

DIP-8 · 8P

NE555P (DIP-8) - 3D-Modell (DIP-8)

NE555P

READY

8P9.6×6.3×3.50mmP=2.54mm4.5 V to 16 V

Schnittstellen-Bridge & Takt-/Timer-IC

TQFP-32(7x7) · 32P

ATMEGA328P-AU (TQFP-32(7x7)) - 3D-Modell (TQFP-32(7x7))

ATMEGA328P-AU

MICROCHIP·TQFP-32(7x7)

READY

32P7.0×7.0×1.00mmP=0.8mm

Eingebetteter Mikrocontroller (MCU)

TQFP-64(10x10) · 8P

PIC24EP512GP806-I/PT (TQFP-64(10x10)) - 3D-Modell (TQFP-64(10x10))

PIC24EP512GP806-I/PT

MICROCHIP(美国微芯)·TQFP-64(10x10)

READY

8P

PIC24EP512GP806-I/PT

QFN-28-EP(6x6) · 8P

PIC18F2580-I/ML (QFN-28-EP(6x6)) - 3D-Modell (QFN-28-EP(6x6))

PIC18F2580-I/ML

MICROCHIP(美国微芯)·QFN-28-EP(6x6)

READY

8P

采用ECAN技术、10位A/D和微功耗技术的28/40/44引脚增强型闪存微控制器

PLCC-32(11.4x14) · 8P

AT27C020-55JU (PLCC-32(11.4x14)) - 3D-Modell (PLCC-32(11.4x14))

AT27C020-55JU

MICROCHIP(美国微芯)·PLCC-32(11.4x14)

READY

8P

AT27C020-55JU

SOIC-18-300mil · 8P

PIC18F1320-I/SO (SOIC-18-300mil) - 3D-Modell (SOIC-18-300mil)

PIC18F1320-I/SO

MICROCHIP(美国微芯)·SOIC-18-300mil

READY

8P

高性能、低功耗带10位A/D的增强型闪存微控制器，具备多种电源管理模式、多振荡器选项和特殊功能

TQFP-32(7x7) · 8P

ATMEGA88V-10AU (TQFP-32(7x7)) - 3D-Modell (TQFP-32(7x7))

ATMEGA88V-10AU

MICROCHIP(美国微芯)·TQFP-32(7x7)

READY

8P

ATMEGA88V-10AU

TQFP-44(10x10) · 8P

PIC24FJ48GA004-I/PT (TQFP-44(10x10)) - 3D-Modell (TQFP-44(10x10))

PIC24FJ48GA004-I/PT

MICROCHIP(美国微芯)·TQFP-44(10x10)

READY

8P

PIC24FJ48GA004-I/PT

TQFP-64(10x10) · 8P

PIC32MX440F256H-80I/PT (TQFP-64(10x10)) - 3D-Modell (TQFP-64(10x10))

PIC32MX440F256H-80I/PT

MICROCHIP(美国微芯)·TQFP-64(10x10)

READY

8P

高性能、通用和USB 32位闪存微控制器

LQFP-100(14x14) · 8P

ATSAM3S1CB-AUR (LQFP-100(14x14)) - 3D-Modell (LQFP-100(14x14))

ATSAM3S1CB-AUR

MICROCHIP(美国微芯)·LQFP-100(14x14)

READY

8P

ATSAM3S1CB-AUR

SSOP-28-208mil · 8P

PIC32MM0128GPM028T-I/SS (SSOP-28-208mil) - 3D-Modell (SSOP-28-208mil)

PIC32MM0128GPM028T-I/SS

MICROCHIP(美国微芯)·SSOP-28-208mil

READY

8P

PIC32MM0128GPM028T-I/SS

SSOP-20-5.2mm · 8P

PIC16F628-20I/SS (SSOP-20-5.2mm) - 3D-Modell (SSOP-20-5.2mm)

PIC16F628-20I/SS

MICROCHIP(美国微芯)·SSOP-20-5.2mm

READY

8P

PIC16F628-20I/SS

PDIP-32 · 8P

AT27C040-90PU (PDIP-32) - 3D-Modell (PDIP-32)

AT27C040-90PU

MICROCHIP(美国微芯)·PDIP-32

READY

8P

AT27C040-90PU

SSOP-28-208mil · 8P

PIC18LF26K80-I/SS (SSOP-28-208mil) - 3D-Modell (SSOP-28-208mil)

PIC18LF26K80-I/SS

MICROCHIP(美国微芯)·SSOP-28-208mil

READY

8P

PIC18LF26K80-I/SS

TQFP-64(10x10) · 8P

PIC18F66J11-I/PT (TQFP-64(10x10)) - 3D-Modell (TQFP-64(10x10))

PIC18F66J11-I/PT

MICROCHIP(美国微芯)·TQFP-64(10x10)

READY

8P

64/80引脚，高性能，1 Mbit闪存微控制器

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