3911 BAUTEILEPDF hochladen

Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

Bauteile (3924 Bauteilen · Seite 246/246)

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TDFN-8-EP(3x3) · 8P

PIC16LF15313T-I/RF (TDFN-8-EP(3x3)) - 3D-Modell (TDFN-8-EP(3x3))

PIC16LF15313T-I/RF

MICROCHIP(美国微芯)·TDFN-8-EP(3x3)

READY

8P

PIC16LF15313T-I/RF

PDIP-20 · 8P

PIC16LF1579-I/P (PDIP-20) - 3D-Modell (PDIP-20)

PIC16LF1579-I/P

MICROCHIP(美国微芯)·PDIP-20

READY

8P

PIC16LF1579-I/P

Through Hole,Right Angle,P=2mm · 8P

HX PM2.0-1x3P WC H6.35 (Through Hole,Right Angle,P=2mm) - 3D-Modell (Through Hole,Right Angle,P=2mm)

HX PM2.0-1x3P WC H6.35

hanxia·Through Hole,Right Angle,P=2mm

READY

8P

Female Header 3 Position 2mm Pitch Single Row Through Hole, Right Angle -40℃~+105℃

- · 8P

CH32V003F4P6-EVT+WCH-LinkE (-) - 3D-Modell (-)

CH32V003F4P6-EVT+WCH-LinkE

WCH(南京沁恒)·-

READY

8P

评估板两件套,含CH32V003测试板一块,LINK-E一个两件套

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