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Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

Bauteile (3844 Bauteilen · Seite 241/241)

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SOT-223 · 8P

MIC37100-3.3WS-TR (SOT-223) - 3D-Modell (SOT-223)

MIC37100-3.3WS-TR

MICROCHIP(美国微芯)·SOT-223

READY

8P

3.3V 1A 6V

PQFP-208(28x28) · 8P

KSZ8999I (PQFP-208(28x28)) - 3D-Modell (PQFP-208(28x28))

KSZ8999I

MICROCHIP(美国微芯)·PQFP-208(28x28)

READY

8P

KS8999 集成9端口10/100交换机，带有PHY和帧缓冲区

Through Hole,Right Angle,P=2mm · 8P

HX PM2.0-1x3P WC H6.35 (Through Hole,Right Angle,P=2mm) - 3D-Modell (Through Hole,Right Angle,P=2mm)

HX PM2.0-1x3P WC H6.35

hanxia·Through Hole,Right Angle,P=2mm

READY

8P

Female Header 3 Position 2mm Pitch Single Row Through Hole, Right Angle -40℃~+105℃

- · 8P

CH32V003F4P6-EVT+WCH-LinkE (-) - 3D-Modell (-)

CH32V003F4P6-EVT+WCH-LinkE

WCH(南京沁恒)·-

READY

8P

评估板两件套,含CH32V003测试板一块,LINK-E一个两件套

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