Elektronischer Bauteilkatalog — Schaltplansymbole, IPC-7351B Footprints & 3D STEP/GLB (Gehäuse HVQFN · Seite 239)

DIP-8 · 8P

NE555P

TI·DIP-8

READY

8P9.6×6.3×3.50mmP=2.54mm4.5 V to 16 V

Schnittstellen-Bridge & Takt-/Timer-IC

TQFP-32(7x7) · 32P

ATMEGA328P-AU

MICROCHIP·TQFP-32(7x7)

READY

32P7.0×7.0×1.00mmP=0.8mm

Eingebetteter Mikrocontroller (MCU)

SOIC-28-300mil · 8P

PIC16LF1773T-I/SO

MICROCHIP(美国微芯)·SOIC-28-300mil

READY

8P

PIC16LF1773T-I/SO

QFN-28-EP(6x6) · 8P

dsPIC33FJ128GP802T-I/MM

MICROCHIP(美国微芯)·QFN-28-EP(6x6)

READY

8P

dsPIC33FJ128GP802T-I/MM

SOP-8-208mil · 8P

PIC12LC508AT-04/SM

MICROCHIP(美国微芯)·SOP-8-208mil

READY

8P

PIC12LC508AT-04/SM

SOP-8-208mil · 8P

PIC12C509AT-04E/SM

MICROCHIP(美国微芯)·SOP-8-208mil

READY

8P

PIC12C509AT-04E/SM

TQFP-48(7x7) · 8P

dsPIC33EV128GM004T-I/P8

MICROCHIP(美国微芯)·TQFP-48(7x7)

READY

8P

dsPIC33EV128GM004T-I/P8

TQFP-48-EP(7x7) · 8P

dsPIC33EP32GS505T-I/PT

MICROCHIP(美国微芯)·TQFP-48-EP(7x7)

READY

8P

dsPIC33EP32GS505T-I/PT

SOT-23-5 · 8P

MCP6281T-E/OTVAO

MICROCHIP(美国微芯)·SOT-23-5

READY

8P

MCP6281T E/OTVAO

MSOP-10 · 8P

TC1304-VI0EUNTR

MICROCHIP(美国微芯)·MSOP-10

READY

8P

TC1304-VI0EUNTR

MSOP-10 · 8P

TC1303C-ZS0EUNTR

MICROCHIP(美国微芯)·MSOP-10

READY

8P

TC1303C-ZS0EUNTR

SSOP-28-208mil · 8P

dsPIC33EP64GP502T-I/SS

MICROCHIP(美国微芯)·SSOP-28-208mil

READY

8P

dsPIC33EP64GP502T-I/SS

VQFN-100-EP(12x12) · 8P

USB5816T/KD

MICROCHIP(美国微芯)·VQFN-100-EP(12x12)

READY

8P

USB5816 6端口 USB 3.1 Gen 1 智能集线器，支持单个 USB Type-C DFP

VQFN-100-EP(12x12) · 8P

USB5816CT-I/KD

MICROCHIP(美国微芯)·VQFN-100-EP(12x12)

READY

8P

USB5816CT-I/KD

Through Hole,Right Angle,P=2mm · 8P

HX PM2.0-1x3P WC H6.35

hanxia·Through Hole,Right Angle,P=2mm

READY

8P

Female Header 3 Position 2mm Pitch Single Row Through Hole, Right Angle -40℃~+105℃

- · 8P

CH32V003F4P6-EVT+WCH-LinkE

WCH(南京沁恒)·-

READY

8P

评估板两件套,含CH32V003测试板一块,LINK-E一个两件套

Bauteile (3824 Bauteilen · Seite 239/239)