3842 BAUTEILEPDF hochladen

Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

Bauteile (3844 Bauteilen · Seite 2/241)

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MLF-6(1.6x1.6) · 7P

MIC5335-PMYMT (MLF-6(1.6x1.6)) - 3D-Modell (MLF-6(1.6x1.6))

MIC5335-PMYMT

MICROCHIP·MLF-6(1.6x1.6)

READY

7P1.6×1.6×0.75mmP=0.51mm2.3V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

- · 7P

MIC5335-SOYMT (-) - 3D-Modell (-)

MIC5335-SOYMT

READY

7P1.6×1.6×0.75mmP=0.51mm2.3V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

MLF-10(3x3) · 11P

MIC2214-PMBML (MLF-10(3x3)) - 3D-Modell (MLF-10(3x3))

MIC2214-PMBML

MICROCHIP·MLF-10(3x3)

READY

11P3.0×3.0×1.00mmP=0.5mm2.25V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

PLCC-28(11.5x11.5) · 28P

SY100H641LJC-TR (PLCC-28(11.5x11.5)) - 3D-Modell (PLCC-28(11.5x11.5))

SY100H641LJC-TR

MICROCHIP·PLCC-28(11.5x11.5)

READY

28P11.5×11.5×1.15mmP=1.27mm1.0V to 2.0V

Standard-Elektronik- & Steckverbinderbauteil

SOIC-28-300mil · 28P

PIC16LF1773T-I/SO (SOIC-28-300mil) - 3D-Modell (SOIC-28-300mil)

PIC16LF1773T-I/SO

MICROCHIP·SOIC-28-300mil

READY

28P17.9×7.5×2.50mmP=1.27mm1.8V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

QFN-28-EP(6x6) · 29P

dsPIC33FJ128GP802T-I/MM (QFN-28-EP(6x6)) - 3D-Modell (QFN-28-EP(6x6))

dsPIC33FJ128GP802T-I/MM

MICROCHIP·QFN-28-EP(6x6)

READY

29P6.0×6.0×0.90mmP=0.65mm3.0V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

SOP-8-208mil · 8P

PIC12LC508AT-04/SM (SOP-8-208mil) - 3D-Modell (SOP-8-208mil)

PIC12LC508AT-04/SM

MICROCHIP·SOP-8-208mil

READY

8P5.3×5.3×1.90mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

SOP-8-208mil · 8P

PIC12C509AT-04E/SM (SOP-8-208mil) - 3D-Modell (SOP-8-208mil)

PIC12C509AT-04E/SM

MICROCHIP·SOP-8-208mil

READY

8P5.3×5.3×1.90mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

TQFP-48(7x7) · 48P

dsPIC33EV128GM004T-I/P8 (TQFP-48(7x7)) - 3D-Modell (TQFP-48(7x7))

dsPIC33EV128GM004T-I/P8

MICROCHIP·TQFP-48(7x7)

READY

48P7.0×7.0×1.20mmP=0.5mm4.5V to 5.5V

Standard-Elektronik- & Steckverbinderbauteil

TQFP-48-EP(7x7) · 48P

dsPIC33EP32GS505T-I/PT (TQFP-48-EP(7x7)) - 3D-Modell (TQFP-48-EP(7x7))

dsPIC33EP32GS505T-I/PT

MICROCHIP·TQFP-48-EP(7x7)

READY

48P7.0×7.0×1.20mmP=0.5mm3.0V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

SOT-23-5 · 5P

MCP6281T-E/OTVAO (SOT-23-5) - 3D-Modell (SOT-23-5)

MCP6281T-E/OTVAO

MICROCHIP·SOT-23-5

READY

5P2.9×1.6×1.10mmP=0.95mm2.2V to 6.0V

Standard-Elektronik- & Steckverbinderbauteil

MSOP-10 · 10P

TC1304-VI0EUNTR (MSOP-10) - 3D-Modell (MSOP-10)

TC1304-VI0EUNTR

MICROCHIP·MSOP-10

READY

10P3.0×3.0×1.10mmP=0.5mm8V to 4.5V

Standard-Elektronik- & Steckverbinderbauteil

MSOP-10 · 10P

TC1303C-ZS0EUNTR (MSOP-10) - 3D-Modell (MSOP-10)

TC1303C-ZS0EUNTR

MICROCHIP·MSOP-10

READY

10P3.0×3.0×1.10mmP=0.5mm8V to 4.5V

Standard-Elektronik- & Steckverbinderbauteil

SSOP-28-208mil · 28P

dsPIC33EP64GP502T-I/SS (SSOP-28-208mil) - 3D-Modell (SSOP-28-208mil)

dsPIC33EP64GP502T-I/SS

MICROCHIP·SSOP-28-208mil

READY

28P10.2×5.3×1.85mmP=0.65mm3.0V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

VQFN-100-EP(12x12) · 101P

USB5816T/KD (VQFN-100-EP(12x12)) - 3D-Modell (VQFN-100-EP(12x12))

USB5816T/KD

MICROCHIP·VQFN-100-EP(12x12)

READY

101P12.0×12.0×0.90mmP=0.4mm

Standard-Elektronik- & Steckverbinderbauteil

VQFN-100-EP(12x12) · 101P

USB5816CT-I/KD (VQFN-100-EP(12x12)) - 3D-Modell (VQFN-100-EP(12x12))

USB5816CT-I/KD

MICROCHIP·VQFN-100-EP(12x12)

READY

101P12.0×12.0×0.90mmP=0.4mm

Standard-Elektronik- & Steckverbinderbauteil

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