4090 BAUTEILEPDF hochladen

Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

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PBGA-272 · 272P

A42MX36-BGG272 (PBGA-272) - 3D-Modell (PBGA-272)

A42MX36-BGG272

MICROCHIP·PBGA-272

READY

272P27.0×27.0×1.35mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

FCBGA-672(27x27) · 672P

LFCPNX-100-8LFG672C (FCBGA-672(27x27)) - 3D-Modell (FCBGA-672(27x27))

LFCPNX-100-8LFG672C

Lattice·FCBGA-672(27x27)

READY

672P27.0×27.0×1.35mmP=1mm1.8 V to 3.3 V

Standard-Elektronik- & Steckverbinderbauteil

SMD1612-4P · 4P

DSC6102HI1A-000.0000T (SMD1612-4P) - 3D-Modell (SMD1612-4P)

DSC6102HI1A-000.0000T

MICROCHIP(美国微芯)·SMD1612-4P

READY

4P1.6×1.2×0.75mmP=0.75mm

Standard-Elektronik- & Steckverbinderbauteil

OSC-SMD_4P-L1.6-W1.2-BL_MICROCHIP_DSC6101H · 4P

C2040989 (OSC-SMD_4P-L1.6-W1.2-BL_MICROCHIP_DSC6101H) - 3D-Modell (OSC-SMD_4P-L1.6-W1.2-BL_MICROCHIP_DSC6101H)

C2040989

Generic·OSC-SMD_4P-L1.6-W1.2-BL_MICROCHIP_DSC6101H

READY

4P1.6×1.2×0.75mmP=0.75mm

Standard-Elektronik- & Steckverbinderbauteil

SMD,26.7x17.8mm · 47P

RN2483A-I/RM105 (SMD,26.7x17.8mm) - 3D-Modell (SMD,26.7x17.8mm)

RN2483A-I/RM105

MICROCHIP·SMD,26.7x17.8mm

READY

47P26.7×17.8×3.10mmP=1.27mm2.1V to 3.6V

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

LFBGA-217 · 217P

AT91SAM9CN12B-CU (LFBGA-217) - 3D-Modell (LFBGA-217)

AT91SAM9CN12B-CU

Microchip Technology·LFBGA-217

READY

217P15.0×15.0×1.35mmP=0.8mm

Schnittstellen-Bridge & Takt-/Timer-IC

- · 7P

FAN5341UMPX-F106 (-) - 3D-Modell (-)

FAN5341UMPX-F106

READY

7P2.0×2.0×0.85mmP=0.65mm2.7 V to 5.5 V

Standard-Elektronik- & Steckverbinderbauteil

MQFP-128(14x20) · 128P

SCH5127-NW (MQFP-128(14x20)) - 3D-Modell (MQFP-128(14x20))

SCH5127-NW

MICROCHIP·MQFP-128(14x20)

READY

128P20.0×14.0×1.60mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

SMD3225-6P · 6P

SWPM201DCAIAB-200.000000 (SMD3225-6P) - 3D-Modell (SMD3225-6P)

SWPM201DCAIAB-200.000000

Starwave(思大)·SMD3225-6P

READY

6P3.2×2.5×1.00mmP=1.05mm

Standard-Elektronik- & Steckverbinderbauteil

CPGA-28(14x16.5) · 28P

AT28C256-25UM/883-815 (CPGA-28(14x16.5)) - 3D-Modell (CPGA-28(14x16.5))

AT28C256-25UM/883-815

MICROCHIP·CPGA-28(14x16.5)

READY

28P15.2×13.7×3.68mm

Standard-Elektronik- & Steckverbinderbauteil

DFN-8-EP(2x3) · 9P

24AA01T-I/MC (DFN-8-EP(2x3)) - 3D-Modell (DFN-8-EP(2x3))

24AA01T-I/MC

MICROCHIP·DFN-8-EP(2x3)

READY

9P3.0×2.0×0.80mmP=0.5mm1.7V-5.5V

Standard-Elektronik- & Steckverbinderbauteil

QFN-12(2x2) · 12P

TLV62585RWTT (QFN-12(2x2)) - 3D-Modell (QFN-12(2x2))

TLV62585RWTT

TI·QFN-12(2x2)

READY

12P2.0×2.0×0.90mmP=0.5mm2.5 V to 5.5 V

Standard-Elektronik- & Steckverbinderbauteil

SMD1612-4P · 4P

DSC6121HI2A-00APT (SMD1612-4P) - 3D-Modell (SMD1612-4P)

DSC6121HI2A-00APT

MICROCHIP·SMD1612-4P

READY

4P1.6×1.2×0.75mmP=0.75mm1.71V to 3.63V

Standard-Elektronik- & Steckverbinderbauteil

SMD1612-4P · 4P

DSC6023HI2A-00A9 (SMD1612-4P) - 3D-Modell (SMD1612-4P)

DSC6023HI2A-00A9

MICROCHIP·SMD1612-4P

READY

4P1.6×1.2×0.75mmP=0.75mm1.71V to 3.63V

Standard-Elektronik- & Steckverbinderbauteil

QFN-64(7x7) · 65P

ATMEGA169PV-8MCHR (QFN-64(7x7)) - 3D-Modell (QFN-64(7x7))

ATMEGA169PV-8MCHR

MICROCHIP·QFN-64(7x7)

READY

65P7.0×7.0×1.35mmP=0.65mm1.8V - 5.5V

Eingebetteter Mikrocontroller (MCU)

- · 37P

ATWINC3400-MR210UA (-) - 3D-Modell (-)

ATWINC3400-MR210UA

READY

37P22.4×14.7×2.40mmP=1.2mm2.7V to 3.6V

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

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