4114 BAUTEILEPDF hochladen

Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

Bauteile (4124 Bauteilen · Seite 106/258)

Zeige 1681–1696 von 4124 Bauteilen

SMD1612-4P · 4P

DSC6121HI2A-00AK (SMD1612-4P) - 3D-Modell (SMD1612-4P)

DSC6121HI2A-00AK

MICROCHIP·SMD1612-4P

READY

4P1.6×1.2×0.75mmP=0.75mm1.71V to 3.63V

Standard-Elektronik- & Steckverbinderbauteil

WFBGA-128 · 128P

MEC1521H-B0-I/TF-TR (WFBGA-128) - 3D-Modell (WFBGA-128)

MEC1521H-B0-I/TF-TR

MICROCHIP·WFBGA-128

READY

128P7.0×7.0×1.35mmP=0.5mm3.5V to 4.1V

Standard-Elektronik- & Steckverbinderbauteil

QFN-36(4x6) · 37P

LE9643AQCT (QFN-36(4x6)) - 3D-Modell (QFN-36(4x6))

LE9643AQCT

MICROCHIP·QFN-36(4x6)

READY

37P6.0×4.0×0.90mmP=0.4mm

Standard-Elektronik- & Steckverbinderbauteil

SMD1612-4P · 4P

AMPDGFH-A09T (SMD1612-4P) - 3D-Modell (SMD1612-4P)

AMPDGFH-A09T

ABRACON·SMD1612-4P

READY

4P1.6×1.2×0.84mmP=0.75mm

Standard-Elektronik- & Steckverbinderbauteil

WFBGA-48 · 48P

MX29LV800CBXHI-70G (WFBGA-48) - 3D-Modell (WFBGA-48)

MX29LV800CBXHI-70G

READY

48P4.0×6.0×1.35mmP=0.5mm2.7V~3.6V

Standard-Elektronik- & Steckverbinderbauteil

OSC-SMD_6P-L3.2-W2.5-BL_MICROCHIP_DSC11X3CXX · 6P

C5128588 (OSC-SMD_6P-L3.2-W2.5-BL_MICROCHIP_DSC11X3CXX) - 3D-Modell (OSC-SMD_6P-L3.2-W2.5-BL_MICROCHIP_DSC11X3CXX)

C5128588

Generic·OSC-SMD_6P-L3.2-W2.5-BL_MICROCHIP_DSC11X3CXX

READY

6P3.2×2.5×1.00mmP=1.05mm

Standard-Elektronik- & Steckverbinderbauteil

TFBGA-144 · 144P

PIC32MZ2048EFM144T-I/JWX (TFBGA-144) - 3D-Modell (TFBGA-144)

PIC32MZ2048EFM144T-I/JWX

MICROCHIP·TFBGA-144

READY

144P7.0×7.0×1.00mmP=0.5mm2.1V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

TFBGA-144 · 144P

PIC32MZ0512EFF144T-E/JWX (TFBGA-144) - 3D-Modell (TFBGA-144)

PIC32MZ0512EFF144T-E/JWX

MICROCHIP·TFBGA-144

READY

144P7.0×7.0×1.00mmP=0.5mm2.1V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

TFBGA-100_L9.0-W9.0-R10-C10-P0.80-TL_MICROCHIP_ATSAM3S1CB · 100P

C618465 (TFBGA-100_L9.0-W9.0-R10-C10-P0.80-TL_MICROCHIP_ATSAM3S1CB) - 3D-Modell (TFBGA-100_L9.0-W9.0-R10-C10-P0.80-TL_MICROCHIP_ATSAM3S1CB)

C618465

Generic·TFBGA-100_L9.0-W9.0-R10-C10-P0.80-TL_MICROCHIP_ATSAM3S1CB

READY

100P9.0×9.0×1.12mmP=0.8mm

Standard-Elektronik- & Steckverbinderbauteil

TFBGA-196 · 196P

SAM9X60D6K-I/4GB (TFBGA-196) - 3D-Modell (TFBGA-196)

SAM9X60D6K-I/4GB

MICROCHIP·TFBGA-196

READY

196P11.0×11.0×1.20mmP=0.65mm

Standard-Elektronik- & Steckverbinderbauteil

OSC-SMD_4P-L1.6-W1.2-BL_MICROCHIP_DSC6101H · 4P

C17355649 (OSC-SMD_4P-L1.6-W1.2-BL_MICROCHIP_DSC6101H) - 3D-Modell (OSC-SMD_4P-L1.6-W1.2-BL_MICROCHIP_DSC6101H)

C17355649

Generic·OSC-SMD_4P-L1.6-W1.2-BL_MICROCHIP_DSC6101H

READY

4P1.6×1.2×0.75mmP=0.75mm

Standard-Elektronik- & Steckverbinderbauteil

PBGA-256(27x27) · 272P

OR2T15B8BA256-DB (PBGA-256(27x27)) - 3D-Modell (PBGA-256(27x27))

OR2T15B8BA256-DB

Lattice·PBGA-256(27x27)

READY

272P27.0×27.0×1.17mmP=1.27mm3.0 V to 3.6 V

Standard-Elektronik- & Steckverbinderbauteil

TFBGA-100_L9.0-W9.0-R10-C10-P0.80-TL_MICROCHIP_ATSAM3S1CB · 100P

C1340622 (TFBGA-100_L9.0-W9.0-R10-C10-P0.80-TL_MICROCHIP_ATSAM3S1CB) - 3D-Modell (TFBGA-100_L9.0-W9.0-R10-C10-P0.80-TL_MICROCHIP_ATSAM3S1CB)

C1340622

Generic·TFBGA-100_L9.0-W9.0-R10-C10-P0.80-TL_MICROCHIP_ATSAM3S1CB

READY

100P9.0×9.0×1.12mmP=0.8mm

Standard-Elektronik- & Steckverbinderbauteil

CSP-201 · 201P

AGLP030V2-CSG201I (CSP-201) - 3D-Modell (CSP-201)

AGLP030V2-CSG201I

MICROCHIP·CSP-201

READY

201P8.0×8.0×0.55mmP=0.5mm1.2 V to 1.5 V

Standard-Elektronik- & Steckverbinderbauteil

- · 272P

ISPLSI81080V-60LB272I (-) - 3D-Modell (-)

ISPLSI81080V-60LB272I

READY

272P27.0×27.0×1.35mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

BGA-272(27x27) · 272P

ISPLSI81080V-60LB272 (BGA-272(27x27)) - 3D-Modell (BGA-272(27x27))

ISPLSI81080V-60LB272

Lattice·BGA-272(27x27)

READY

272P27.0×27.0×1.35mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

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