4094 BAUTEILEPDF hochladen

Alle Gehäuse RF-Modul BGA / WLCSP QFN / DFN LQFP / TQFP SOIC / TSSOP SOT / TO DIP / THT

Bauteile (4104 Bauteilen · Seite 102/257)

Zeige 1617–1632 von 4104 Bauteilen

272-PBGA (27x27) · 272P

70V5388S166BG8 (272-PBGA (27x27)) - 3D-Modell (272-PBGA (27x27))

70V5388S166BG8

RENESAS·272-PBGA (27x27)

READY

272P27.0×27.0×1.35mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

VFLGA-4 · 4P

DSC6121HI2A-0090 (VFLGA-4) - 3D-Modell (VFLGA-4)

DSC6121HI2A-0090

MICROCHIP·VFLGA-4

READY

4P1.2×1.6×1.15mmP=0.75mm1.71V to 3.63V

Standard-Elektronik- & Steckverbinderbauteil

TFBGA-144 · 144P

PIC32MZ2048EFH144T-I/JWX (TFBGA-144) - 3D-Modell (TFBGA-144)

PIC32MZ2048EFH144T-I/JWX

MICROCHIP·TFBGA-144

READY

144P7.0×7.0×1.00mmP=0.5mm2.1V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

TFBGA-100_L9.0-W9.0-R10-C10-P0.80-TL_MICROCHIP_ATSAM3S1CB · 100P

C618437 (TFBGA-100_L9.0-W9.0-R10-C10-P0.80-TL_MICROCHIP_ATSAM3S1CB) - 3D-Modell (TFBGA-100_L9.0-W9.0-R10-C10-P0.80-TL_MICROCHIP_ATSAM3S1CB)

C618437

Generic·TFBGA-100_L9.0-W9.0-R10-C10-P0.80-TL_MICROCHIP_ATSAM3S1CB

READY

100P9.0×9.0×1.12mmP=0.8mm

Standard-Elektronik- & Steckverbinderbauteil

TFBGA-100_L9.0-W9.0-R10-C10-P0.80-TL_MICROCHIP_ATSAM3S1CB · 100P

C618439 (TFBGA-100_L9.0-W9.0-R10-C10-P0.80-TL_MICROCHIP_ATSAM3S1CB) - 3D-Modell (TFBGA-100_L9.0-W9.0-R10-C10-P0.80-TL_MICROCHIP_ATSAM3S1CB)

C618439

Generic·TFBGA-100_L9.0-W9.0-R10-C10-P0.80-TL_MICROCHIP_ATSAM3S1CB

READY

100P9.0×9.0×1.12mmP=0.8mm

Standard-Elektronik- & Steckverbinderbauteil

TFBGA-144 · 144P

PIC32MZ2048EFG144T-I/JWX (TFBGA-144) - 3D-Modell (TFBGA-144)

PIC32MZ2048EFG144T-I/JWX

MICROCHIP·TFBGA-144

READY

144P7.0×7.0×1.00mmP=0.5mm2.1V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

TFBGA-144 · 144P

PIC32MZ1024EFE144T-E/JWX (TFBGA-144) - 3D-Modell (TFBGA-144)

PIC32MZ1024EFE144T-E/JWX

MICROCHIP·TFBGA-144

READY

144P7.0×7.0×1.00mmP=0.5mm2.1V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

TFBGA-144 · 144P

PIC32MZ1024EFM144T-E/JWX (TFBGA-144) - 3D-Modell (TFBGA-144)

PIC32MZ1024EFM144T-E/JWX

MICROCHIP·TFBGA-144

READY

144P7.0×7.0×1.00mmP=0.5mm2.1V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

TFBGA-144 · 144P

PIC32MZ2048EFH144T-250I/JWX (TFBGA-144) - 3D-Modell (TFBGA-144)

PIC32MZ2048EFH144T-250I/JWX

MICROCHIP·TFBGA-144

READY

144P7.0×7.0×1.00mmP=0.5mm2.1V to 3.6V

Standard-Elektronik- & Steckverbinderbauteil

TFBGA-361 · 361P

ATSAMA5D42B-CUR (TFBGA-361) - 3D-Modell (TFBGA-361)

ATSAMA5D42B-CUR

MICROCHIP·TFBGA-361

READY

361P16.0×16.0×1.12mmP=0.8mm

Standard-Elektronik- & Steckverbinderbauteil

PBGA-272 · 272P

A42MX36-3BG272 (PBGA-272) - 3D-Modell (PBGA-272)

A42MX36-3BG272

MICROCHIP·PBGA-272

READY

272P27.0×27.0×1.35mmP=1.27mm

Standard-Elektronik- & Steckverbinderbauteil

SMD-51P · 59P

ATSAMW25H18-MR210PB1954 (SMD-51P) - 3D-Modell (SMD-51P)

ATSAMW25H18-MR210PB1954

MICROCHIP·SMD-51P

READY

59P30.8×14.2×2.40mmP=1.2mm2.7 to 3.6V

Drahtloses Wi-Fi / Bluetooth LE SoC-Funkmodul

PBGA-324(23x23) · 324P

ZL50118GAG2 (PBGA-324(23x23)) - 3D-Modell (PBGA-324(23x23))

ZL50118GAG2

MICROCHIP·PBGA-324(23x23)

READY

324P23.0×23.0×1.35mmP=1mm

Standard-Elektronik- & Steckverbinderbauteil

PBGA-256(27x27) · 272P

OR2T10A4BA256I-DB (PBGA-256(27x27)) - 3D-Modell (PBGA-256(27x27))

OR2T10A4BA256I-DB

Lattice·PBGA-256(27x27)

READY

272P27.0×27.0×1.17mmP=1.27mm3.0 V to 3.6 V

Standard-Elektronik- & Steckverbinderbauteil

UFBGA-88(6x6) · 88P

ATMXT640UD-CCUR002 (UFBGA-88(6x6)) - 3D-Modell (UFBGA-88(6x6))

ATMXT640UD-CCUR002

MICROCHIP·UFBGA-88(6x6)

READY

88P6.0×6.0×0.60mmP=0.5mm1.8 V to 3.3 V

Standard-Elektronik- & Steckverbinderbauteil

VFBGA-64(5.5x5.5) · 64P

CEC1736-S0-I/2HW-PROTO (VFBGA-64(5.5x5.5)) - 3D-Modell (VFBGA-64(5.5x5.5))

CEC1736-S0-I/2HW-PROTO

MICROCHIP·VFBGA-64(5.5x5.5)

READY

64P5.5×5.5×0.80mmP=0.5mm

Standard-Elektronik- & Steckverbinderbauteil

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